Solderquik.com is a registered domain for
Winslow Automation Inc. dba Six Sigma Microelectronics

Product solutions for microelectronic component interconnect alteration
and package integrity testing.

Product Division

Winslow Automation, Inc has been advancing lead finish and soldering technology for the military and aerospace, telecommunications, medical and consumer electronics industry since its inception in 1986.

Winslow Automation's soldering solutions for electronic component solder applications and repair includes consumables as well as equipment.


SolderQuik BGA Preforms
BGA Reballing Kit

Service Division

Six Sigma Microelectronics performs specialized microelectronic component modification services such as Column Attach, Ball Attach & Reballing, and Hot Solder Dip.

Our test services includes solderability, hermeticity ionic cleanliness, physical dimensions and many more.

Analytical services include 3D X-ray, Acoustic Microscopy, and Metallographic Cross-Sectioning.


Component services
Test Services
Analytical Services

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